Thermal analysis of the adhesive was performed to identify the incomplete cure of the adhesive after first curing process and the penetration of moisture into the package is the main reason for sharp stress increase 运用tga 、 dta等热分析手段对粘合剂的固化过程和再固化过程进行了研究，并对实验中的应力突变的机理进行探讨，认为水汽是导致应力突变的主要原因。
